Advanced Electronic Packaging (EBT 439/3): Reserves

This text is designed for the undergraduate one-term Quantitative Analysis course (sometimes called Analytical Chemistry) for students majoring in Chemistry and related fields. It deals with principles and techniques of quantitative analysis. Examples of analytical techniques are drawn from such areas as life sciences, clinical chemistry, air and water pollution, and industrial analyses.The Sixth Edition is extensively revised and updated with a more modern flavor and a new, two-color design.

*Covers design, packaging, construction, assembly, and application of all three approaches to Area Array Packaging: Ball Grid Array (BGA), Chip Scale Package (CSP), and Flip Chip (FC)*Details the pros and cons of each technology with varying applications *Examines packaging ramifications of high density interconnects (HDI)

Covering every aspect of electronic packaging from development and design to manufacturing, facilities, and testing, Electronic Packaging and Interconnection Handbook, Third Edition, continues to be the standard reference in its field. Here, in this single information-packed resource are all the data and guidelines you need for all types and levels of electronic packages, interconnection technologies, and electronic systems. No other book treats all of the subjects covered in this handbook in such an integrated and inter-related manner, a treatment designed to help you achieve a more reliable, more manufacturable, and more cost-effective electronic package. Here's everything you need to know about materials, thermal management, mechanical and thermomechanical stress behavior, wiring and cabling, soldering and solder technology, integrated circuit packaging, surface mount technologies, rigid and flexible printed wiring boards. And with over 60% new material, this third edition brings you thoroughly up to speed on a new generation of packaging technologies: single chip packaging...ball gridarrays...chip scale packaging...low-cost flip chiptechnologies...direct chip attach, and more.

Low-Cost Flip Chip Technologies:For DCA, WLCSP, and PBGA AssembliesJohn H. LauThe first comprehensive and in-depth guide to low-cost flip chip technologies, this reference gives you cutting edge information on the most important new developments and latest research results in applying flip chip technologies to direct chip attach (DCA) - also called flip chip on board (FCOB), wafer level chip scale package (WLCSP), and plastic ball grid array (PBGA) package assemblies. For professionals active in flip chip research and development, those who wish to master flip chip problem-solving methods, and those who must choose a cost-effective design and high-yield manufacturing process for their interconnect systems, here is a timely summary of progress in all aspects of this fascinating field.This one-stop guide meets the reference needs of engineers in the fields of design, materials, process, equipment, manufacturing, quality control, product assurance, reliability, component, packaging, marketing, and systems design, and technical managers working in electronic packaging and interconnection. With this book you will develop a practical understanding of the economic, design, materials, process, equipment, quality, manufacturing, and reliability issues of low-cost flip chip technologies. Among the topics explored:· IC trends and packaging technology updates· More than 12 different wafer-bumping methods· More than 100 lead-free solder alloys· Sequential build up PCB with microvias and via-in-pad· FCOB with anisotropic conductive film (ACF)· FCOB with anisotropic conductive adhesive (ACA)· Solder-bumped FCOB with conventional underfills· Solder-bumped FCOB with no-flow underfills· Solder-bumped FCOB with imperfect underfills· Physical and mechanical properties of underfills· How to select underfill materials· Thermal management of solder-bumped FCOB· Reliability of solder-bumped FCOB· Failure analysis of solder-bumped FCOB· Design, materials, process, and reliability of WLCSPs· Solder-bumped flip chip in PBGA packages· Fracture mechanics analysis of delaminations· Creep analysis of solder jointsLow-cost flip chip technology is taking the electronics industry by storm. Page after page, this standard-setting guide gives you both essential technical details and an eye-opening overview of this fast-developing field. No matter how you use Low-Cost Flip Chip Technologies For DCA, WLCSP, and PBGA Assemblies, you'll see why it's the resource of choice for those who want to be at the top of the game.

The first comprehensive, in-depth guide to chip scale packaging, this reference gives you cutting-edge information on the most important new development in electronic packaging since surface mount technology (SMT). Featuring the latest design techniques, plus details on more than 40 different types of CSP, Chip Scale Package hands engineers and designers the complete, professional set of working tools that they need to solve technical and design issues; find the most efficient, cost-effective CSP solutions for their deployments; answer questions on interfacing, speed, robustness, and more; compare properties of wirebonds, flip chips, rigid and flex substrates, wafer-level redistribution, and other CSP products; get the latest information on new offerings from Fujitsu, GE, Hitachi, IBM, Matushita, Motorola, National Semiconductor, NEC, Sharp, Sony, Toshiba, Amkor, TT, LG Semicon, Mitsubishi, Shell Case, Tessera, Samsung, and other major companies; and learn about CSP products under development. A revolution in electronics, CSP is taking the electronics industry by storm. Page after page, this standard-setting guide gives you both essential technical details and an eye-opening overview of this fast-developing field. No matter how you use Chip Scale Package, youÃ-ll see why itÃ-s the resource of choice for those who want to be at the top of the game.

From the reviews: "This book is intended for an assembly production house setting, appropriate for management, designers, chief operators, as well as wirebond production engineers. Operational issues such as specifying and optimizing wire and automatic bonders for a product line are included. The book is very good with "visual" explanations for quick grasping of the issues. In addition, the fundamental metallurgical or mechanical root causes behind material and process choices are presented. The book has a clear prose style and a very readable font and page layout. The figures, although effective, are simply low resolution screen prints from a personal computer and thus have aliasing and fuzziness. This book has excellent overall tutorial and enough description of wire and bonding equipment so the reader could specify and negotiate correctly for with suppliers. The majority of the book dwells on establishing the bonding process for a particular product; determining the "window" of adjustments. The book ends with discussions on establishing quality metrics and reliability assurance tests. Each chapter of the book includes enough tutorial information to allow it to alone with little need to page backwards. A short but good reference section is at the end. If you have not read a wirebonding book, or the one you read 10 years ago was borrowed and never returned, now is the time to buy this book." ( CMPT Newsletter, June 2005)

Suitable as a reference work for reliability professionals or as a text for advanced undergraduate or graduate students, this book introduces the reader to the widely dispersed reliability literature of microelectronic and electronic-optional devices. Reliability and Failure of Electronic Materials and Devices integrates a treatment of chip and packaging level failures within the context of the atomic mechanisms and models used to explain degradation, and the statistical handling of lifetime data. Electromigration, dielectric radiation damage and the mechanical failure of contacts and solder joints are among the failure mechanisms considered. An underlying thread of the book concerns product defects--their relation to yield and reliability, the role they play in failure, and the way they are experimentally exposed. The reader will gain a deeper physical understanding of failure mechanisms in electronic materials and devices, acquire skills in the mathematical handling of reliability data, and better appreciate future technology trends and the reliability issues they raise. Key Features * Discusses reliability and failure on both the chip and packaging levels * Handles the role of defects in yield and reliability * Includes a tutorial chapter on the mathematics of reliability * Focuses on electromigration, dielectric breakdown, hot-electron effects, electrostatic discharge, corrosion, radiation damage and the mechanical failure of packages, contacts, and solder joints * Considers defect detection methods and failure analysis techniques

What makes some computers slow? Why do some digital systems operate reliably for years while others fail mysteriously every few hours? How can some systems dissipate kilowatts while others operate off batteries? These questions of speed, reliability, and power are all determined by the system-level electrical design of a digital system. Digital Systems Engineering presents a comprehensive treatment of these topics. It combines a rigorous development of the fundamental principles in each area with real-world examples of circuits and methods. The book not only serves as an undergraduate textbook, filling the gap between circuit design and logic design, but can also help practising digital designers keep pace with the speed and power of modern integrated circuits. The techniques described in this book, once used only in supercomputers, are essential to the correct and efficient operation of any type of digital system.