This is the "Subject Guides to Semiconductor Packaging" page of the "Semiconductor Packaging (EMT470/3)" guide.
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Semiconductor Packaging (EMT470/3)  

Last Updated: Jul 17, 2016 URL: Print Guide RSS UpdatesEmail Alerts

Subject Guides to Semiconductor Packaging Print Page

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Subject Guides to Semiconductor Packaging

Use this subject guide to help you finding information on the subject, Semiconductor Packaging. The Library provides both printed, multimedia and electronic resources to help you finding relevant information for your assignments, teaching-learning and research projects. If you need more information about the subject, please feel free to contact us via voice mail, email or Ask Us platforms.


Course Synopsis

Students will be exposed to Microsystems packaging, the role of packaging in microelectronics, fundamental of IC assembly, general semiconductor process flow, design for reliability, thermal management, sealing and encapsulation, packaging material and processes, and latest packaging technology trend via latest scientific papers. The students will also be exposed to identifying critical packaging parameters and interpreting data of their own designed experiment. Mathematical modelling in packaging are also introduced.


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